SOLUTIONS

Semiconductor

Two autocollimators are used to measure the parallelism of the measured object

Two autocollimators are used to measure the parallelism of the measured object
Semiconductor Optical partsParallelism
Two autocollimators are used to measure the squareness of the measured object

Two autocollimators are used to measure the squareness of the measured object
Semiconductor Optical partsSquareness
Confirmation of parallelism between die collet and reference plane

Confirmation of parallelism between die collet and reference plane
Semiconductor Semiconductor chipParallelism
Optical axis adjustment of semiconductor wafer projection (exposure) lens block

Optical axis adjustment of semiconductor wafer projection (exposure) lens block
Semiconductor PhotomaskLensOptical axisSemiconductor exposure equipment
Non-contact angle confirmation of ellipsometer measuring object

Non-contact angle confirmation of ellipsometer measuring object
Semiconductor EllipsometerSemiconductor waferEmbedded
Posture non-contact monitoring of semiconductor wafers, handlers, and carriers from a distance

Posture non-contact monitoring of semiconductor wafers, handlers, and carriers from a distance
Semiconductor Wafer handlerSemiconductor wafer
Non-contact measurement of semiconductor wafer tilt and blur during spin-coating

Non-contact measurement of semiconductor wafer tilt and blur during spin-coating
Semiconductor Spin coaterSemiconductor wafer
Non-contact measurement of semiconductor wafer shape(warpage) after cutting and polishing

Non-contact measurement of semiconductor wafer shape(warpage) after cutting and polishing
Semiconductor Semiconductor waferWarping
Non-contact warpage measurement of semiconductor wafers in thermostatic chambers and vacuum chambers

Non-contact warpage measurement of semiconductor wafers in thermostatic chambers and vacuum chambers
Semiconductor Semiconductor waferWarping