Non-contact posture monitoring of pickups with vacuum nozzles

１.Issues

・We want to improve the posture variation of semiconductor chips when vacuum nozzles are used to pick up semiconductor chips.

2.Solutions

・When a vacuum nozzle is used to pick up a semiconductor chip, a tilt sensor is used to check the posture (angle) of the semiconductor chip. This enables secure pick-up and positioning of semiconductor
chips. This improves the posture variation, increasing yield and shortening takt time.