SOLUTIONS

Non-contact measurement of semiconductor wafer tilt and blur during spin-coating

Non-contact measurement of semiconductor wafer tilt and blur during spin-coating
Non-contact measurement of semiconductor wafer tilt and blur during spin-coating

Is it possible to measure semiconductor wafers (inclination at high speed rotation) in the spin-coater process in a simple, non-contact manner?

By measuring the angle with a tilt sensor, the tilt of semiconductor wafers and blurring during high-speed rotation can be easily and contactlesslychecked during the spin-coater process. It also improves the yield of resist solution coating process.

Related Products